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SI7232DN-T1-GE3 2N CH Mosfet Array 20V 25A 23W PPAK 1212-8

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SI7232DN-T1-GE3 2N CH Mosfet Array 20V 25A 23W PPAK 1212-8

Name: SI7232DNT1GE3 2N CH Mosfet Array 20V 25A 23W PPAK 12128
Brand: original
Price: 1 USD

Brand Name : original

Model Number : SI7232DN-T1-GE3

Certification : original

Place of Origin : original

MOQ : 1

Price : negotiation

Payment Terms : T/T, L/C

Supply Ability : 100,000

Delivery Time : 1-3working days

Packaging Details : carton box

Product Status : Active

Technology : MOSFET (Metal Oxide)

Configuration : 2 N-Channel (Dual)

FET Feature : Logic Level Gate

Drain to Source Voltage (Vdss) : 20V

Current - Continuous Drain (Id) @ 25°C : 25A

Rds On (Max) @ Id, Vgs : 16.4mOhm @ 10A, 4.5V

Vgs(th) (Max) @ Id : 1V @ 250µA

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SI7232DN-T1-GE3 Current Sense Resistors Mosfet 2n-Ch 20v 25a Ppak 1212-8

Mosfet Array 20V 25A 23W Surface Mount PowerPAK® 1212-8 Dual

Specifications of SI7232DN-T1-GE3

TYPE	DESCRIPTION
Category	Discrete Semiconductor Products
	Transistors
	FETs, MOSFETs
	FET, MOSFET Arrays
Mfr	Vishay Siliconix
Series	TrenchFET®
Package	Tape & Reel (TR)
	Cut Tape (CT)
	Digi-Reel®
Product Status	Active
Technology	MOSFET (Metal Oxide)
Configuration	2 N-Channel (Dual)
FET Feature	Logic Level Gate
Drain to Source Voltage (Vdss)	20V
Current - Continuous Drain (Id) @ 25°C	25A
Rds On (Max) @ Id, Vgs	16.4mOhm @ 10A, 4.5V
Vgs(th) (Max) @ Id	1V @ 250µA
Gate Charge (Qg) (Max) @ Vgs	32nC @ 8V
Input Capacitance (Ciss) (Max) @ Vds	1220pF @ 10V
Power - Max	23W
Operating Temperature	-55°C ~ 150°C (TJ)
Mounting Type	Surface Mount
Package / Case	PowerPAK® 1212-8 Dual
Supplier Device Package	PowerPAK® 1212-8 Dual
Base Product Number	SI7232

Features of SI7232DN-T1-GE3

The PowerPAK 1212-8 package (Figure 1) is a derivative of PowerPAK SO-8. It utilizes the same packaging technology, maximizing the die area. The bottom of the die attach pad is exposed to provide a direct, low resistance thermal path to the substrate the device is mounted on. The PowerPAK 1212-8 thus translates the benefits of the PowerPAK SO-8 into a smaller package, with the same level of thermal performance. (Please refer to application note “PowerPAK SO-8 Mounting and Thermal Considerations.”)

Applications of SI7232DN-T1-GE3

Vishay Siliconix surface-mount packages meet solder reflow reliability requirements. Devices are subjected to solder reflow as a preconditioning test and are then reliability-tested using temperature cycle, bias humidity, HAST, or pressure pot. The solder reflow tempera

Environmental & Export Classifications of SI7232DN-T1-GE3

ATTRIBUTE	DESCRIPTION
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)
ECCN	EAR99
HTSUS	8541.29.0095

SI7232DN-T1-GE3 2N CH Mosfet Array 20V 25A 23W PPAK 1212-8

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